Publication

Special Issue submission deadline September 30, 2023

SUBMIT MANUSCRIPTS for special issue:

The special issue submission is on, please find the following information regarding special issue submission for ICLED2023, Singapore.

 Memories - Materials, Devices, Circuits and Systems:

“VSI:Low-Energy Devices”

Journal of Electronic Materials

SI: International Conference on Low Energy Digital Devices and Computing.

Regarding Materials Circular Economy,

TC: ICLED 2023 

For timely publication, completed texts of abstract and manuscripts must be prepared according guidelines below. 

Abstract Submission Deadline :   May 25, 2023

Submission Email Inquiry:  contact@cimotechedu.com/goutam.dalapati@sunkonnect.co

Subject of Email: Surrname_Firstname_Topic_ORAL/POSTER

Abstract Format: English, Times New Roman (12 pt font) with left and right sides justified, 200 words.

Camera Ready Submission: August 31, 2023

Proceeding Format: English, Open format, Max 6 Pages, 12 point, Single Spacing

Selected accepted papers will be e-published in Conference Proceedings (Edited Volume with ISBN).  

Copyrights

Authors who are registered will be provided with the Consent and Release Form. These forms allow the organizers right to use, distribute, publish, exhibit, digitize, broadcast, reproduce and archive, in any format or medium, whether now known or hereafter developed any materials, including written, audio and visual works. One of these forms are required by each speaker in order to present at the conference.